Semiconductor packaging is carried out to provide
protection to the wafer or substrate. The casing (package) is built from
materials such as plastic, metal, glass, or ceramic and contains one or more
semiconductor electronic components. Semiconductor advanced packaging is a key
component of the semiconductor manufacturing process. The package of a
semiconductor device is usually made of materials such as plastic, metal,
ceramic/glass. Packaging is undertaken to provide protection against impact and
corrosion. It also has contact pins or leads used to connect external circuits
to the device; the package also dissipates the heat produced in the device.
Some of the advanced packaging technologies used in semiconductor device
packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in
wafer-level packaging (FI WLP), and 2.5D/3D.
Complete
Report Available @ https://www.radiantinsights.com/research/global-semiconductor-advanced-packaging-market-2017-2021
Covered
in this report
The report covers the present scenario and the
growth prospects of the global semiconductor advanced packaging market for
2017-2021. To calculate the market size, the report considers the sale of
semiconductor capital equipment to end-use segments.
The
market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA
Global Semiconductor Advanced Packaging Market
2017-2021, has been prepared based on an in-depth market analysis with inputs
from industry experts. The report covers the market landscape and its growth
prospects over the coming years. The report also includes a discussion of the
key vendors operating in this market.
Avail
Sample Report @ https://www.radiantinsights.com/research/global-semiconductor-advanced-packaging-market-2017-2021/request-sample
Key
vendors
- Advanced Semiconductor Engineering (ASE)
- Amkor Technology
- Samsung Semiconductor (SAMSUNG)
- TSMC (Taiwan Semiconductor Manufacturing Company)
Other
prominent vendors
- China Wafer Level CSP
- ChipMOS TECHNOLOGIES
- FlipChip International
- HANA Micron
- Interconnect Systems (Molex)
- Jiangsu Changjiang Electronics Technology (JCET)
- King Yuan Electronics
- Tongfu Microelectronics
- Nepes
- Powertech Technology (PTI)
- SIGNETICS
- Tianshui Huatian
- Ultratech
- UTAC
About
Radiant Insights,Inc
Radiant Insights is a platform for companies looking
to meet their market research and business intelligence requirements. We assist
and facilitate organizations and individuals procure market research reports,
helping them in the decision making process. We have a comprehensive collection
of reports, covering over 40 key industries and a host of micro markets. In
addition to over extensive database of reports, our experienced research
coordinators also offer a host of ancillary services such as, research
partnerships/ tie-ups and customized research solutions.
Media
Contact:
Michelle Thoras
201 Spear Street 1100,
Suite 3036, San Francisco,
CA 94105, United States
Tel: 1-415-349-0054
Toll Free: 1-888-928-9744
Mail: sales@radiantinsights.com
Michelle Thoras
201 Spear Street 1100,
Suite 3036, San Francisco,
CA 94105, United States
Tel: 1-415-349-0054
Toll Free: 1-888-928-9744
Mail: sales@radiantinsights.com
No comments:
Post a Comment